| ||||||||||||||||||||||||||||||||||||
|
| ||||||||||||||||||||||||||||||||||||
| Job description | ||||||||||||||||||||||||||||||||||||
| The objective of this position is to deliver single pattern and multiple (double pattern/ triple pattern) pattern mask solutions at 20nm and 14nm technology nodes design rule features on 450mm wafers with proven resolution enhancements techniques supported by Optical Proximity Correction (OPC) Modeling. Reticle solutions to be supported may include 193nm wave length dry, 193nm wavelength immersion and EUV scanners. The position will require working within a technical organization consisting of process modules, metrology and integration/device engineers in a highly matrixed environment to ensure effective delivery of test structures, mask designs and process flows in support of test wafer generation and equipment demonstrations. Specific roles and responsibilities will include: • Identify, develop and implement critical test structures on 450mm wafers required by various process modules to prove out process and equipment demonstrations. • Work with test structure design and mask layout service providers to deliver test structure designs consistent with the desired process technology node. • Work with reticle suppliers to identify, develop and implement metrology data collection schemes to generate data for OPC model development, creation and validation. • Execute the CD SEM metrology data collection to provide highly reliable and valid data for use in OPC model development and validation • Work with reticle supplier to develop, create, exercise, validate and correct the OPC models to deliver the desired pattern on wafer results. • Work with G450C Procurement organization to obtain the required budget and service support to effect timely delivery of the reticles consistent with the G450C needs. • Other duties as assigned | ||||||||||||||||||||||||||||||||||||
Required
| ||||||||||||||||||||||||||||||||||||
Preferred
| ||||||||||||||||||||||||||||||||||||
| Additional information
Required Experience: • OPC modeling in an R&D setting with knowledge of at least one S/C industry standard OPC software product. • Understanding of litho, OPC processes and Litho/Etch/OPC process solution integration. • A critical dimension metrology background and familiarity with software versions of the latest CD SEM tools, identification of and providing solutions to measurement challenges. • Understanding of experimental design methodologies, statistics and other analytical skills for data collection and evaluation. • Development and delivery of test structures • Mask set design | ||||||||||||||||||||||||||||||||||||
| IBM is committed to creating a diverse environment and is proud to be an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, genetics, disability, age, or veteran status. |
Tuesday, 22 October 2013
450mm Semiconductor OPC Modeling Engineer
Posted by Unknown on 23:00 with No comments
Subscribe to:
Post Comments (Atom)
0 comments:
Post a Comment