Job details
- Job Number: 28704553
- Santa Clara Valley, California, United States
- Posted: Sep. 10, 2013
- Weekly Hours: 40.00
Job Summary
The
Mobile Devices group is seeking an experienced professional who brings
expertise in the area of semiconductor packaging over-mold technology.
This engineer will assist in the development and refinement of
over-molding technologies and systems for semiconductor devices and
substrates. The successful engineer in this role will be able to work
closely with suppliers and deliver scalable manufacturing processes in a
timely manner.
Key Qualifications
- Extensive experience working with molding materials and process technologies, underfill materials and processes, all in the context of high-volume semiconductor/electronics manufacturing
- Experience with SMT technologies & equipment
- Deep understanding of the industry business dynamics
- Experience/background working with Asia-based manufacturing suppliers
- Desire and ability for problem solving and debugging
- Ability to work with a wide range of people with varying degrees of experience
- Mold-flow simulation/analysis experience
- Strong documentation and communication skills
Description
•Work with Asia-based suppliers to develop over-mold process technologies
•Scope and select suitable over-mold and under-fill technologies, equipment and solution
suitable for product requirements
•Provide engineering support for product builds at the factory
•Work with Operations group and the extended supply chain to address tooling and process lead-times
Education
B.S or M.S in Physics, Material Science or related with 10+ years experience
Valuable Prior Work Experience:
Experience working directly for molding equipment vendors
Experience with CAD/tooling for molding and/or underfill equipment
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